Nonvolatile semiconductor memory device and method of manufacturing the same

ABSTRACT

According to an embodiment, a nonvolatile semiconductor memory device comprises a plurality of conductive layers that are stacked in plurality in a first direction via an inter-layer insulating layer, that extend in a second direction which intersects the first direction, and that are disposed in plurality in a third direction which intersects the first direction and the second direction. In addition, the same nonvolatile semiconductor memory device comprises: a semiconductor layer that has the first direction as a longitudinal direction; a tunnel insulating layer that contacts a side surface of the semiconductor layer; a charge accumulation layer that contacts a side surface of the tunnel insulating layer; and a block insulating layer that contacts a side surface of the charge accumulation layer. Furthermore, in the same nonvolatile semiconductor memory device, an end in the third direction of the plurality of conductive layers is rounded.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/235,435 filed Dec. 28, 2018, which is a continuation of U.S.application Ser. No. 14/844,382 filed Sep. 3, 2015 (now U.S. Pat. No.10,192,753 issued Jan. 29, 2019), which is based upon and claims thebenefit of U.S. Provisional Patent Application No. 62/050,335 filed Sep.15, 2014, the entire contents of each of which are incorporated hereinby reference.

FIELD

Embodiments described here relate to a nonvolatile semiconductor memorydevice and a method of manufacturing the same.

BACKGROUND Description of the Related Art

A memory cell configuring a nonvolatile semiconductor memory device suchas a NAND type flash memory includes a semiconductor layer, a controlgate, and a charge accumulation layer. The memory cell changes itsthreshold voltage according to a charge accumulated in the chargeaccumulation layer and stores a magnitude of this threshold voltage asdata. In recent years, enlargement of capacity and raising ofintegration level has been proceeding in such a nonvolatilesemiconductor memory device. Moreover, a nonvolatile semiconductormemory device in which the memory cells are three-dimensionally disposed(a three-dimensional type semiconductor memory device) has been proposedto raise integration level of the memory.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram showing a schematic configuration of anonvolatile semiconductor memory device according to a first embodiment.

FIG. 2 is a circuit diagram showing a configuration of part of the samenonvolatile semiconductor memory device.

FIG. 3 is a schematic perspective view showing a configuration of partof the same nonvolatile semiconductor memory device.

FIG. 4 is a schematic cross-sectional view showing a configuration ofpart of the same nonvolatile semiconductor memory device.

FIG. 5 is a schematic cross-sectional view showing a configuration ofpart of the same nonvolatile semiconductor memory device.

FIG. 6 is a schematic cross-sectional view showing a configuration ofpart of the same nonvolatile semiconductor memory device.

FIG. 7 is a schematic cross-sectional view showing a configuration ofpart of the same nonvolatile semiconductor memory device.

FIG. 8 is a schematic view for explaining a write operation of the samenonvolatile semiconductor memory device.

FIG. 9 is a schematic view for explaining the write operation of thesame nonvolatile semiconductor memory device.

FIG. 10 is a schematic view for explaining a read operation of the samenonvolatile semiconductor memory device.

FIG. 11 is a schematic view for explaining an erase operation of thesame nonvolatile semiconductor memory device.

FIG. 12 is a cross-sectional view showing a configuration of part of anonvolatile semiconductor memory device according to a comparativeexample.

FIG. 13 is a cross-sectional view showing a manufacturing process of thenonvolatile semiconductor memory device according to the firstembodiment.

FIG. 14 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 15 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 16 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 17 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 18 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 19 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 20 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 21 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 22 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 23 is a cross-sectional view showing a manufacturing process of anonvolatile semiconductor memory device according to a secondembodiment.

FIG. 24 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 25 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to a thirdembodiment.

FIG. 26 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 27 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 28 is a cross-sectional view showing a manufacturing process of anonvolatile semiconductor memory device according to a fourthembodiment.

FIG. 29 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 30 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to a fifthembodiment.

FIG. 31 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 32 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 33 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 34 is a schematic perspective view showing a configuration of partof a nonvolatile semiconductor memory device according to a sixthembodiment.

FIG. 35 is a circuit diagram showing a configuration of part of the samenonvolatile semiconductor memory device.

FIG. 36 is a schematic cross-sectional view showing a configuration ofpart of the same nonvolatile semiconductor memory device.

FIG. 37 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 38 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 39 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 40 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 41 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 42 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 43 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 44 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 45 is a cross-sectional view showing a manufacturing process of thesame nonvolatile semiconductor memory device.

FIG. 46 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to anotherembodiment.

FIG. 47 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to anotherembodiment.

FIG. 48 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to anotherembodiment.

FIG. 49 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to anotherembodiment.

FIG. 50 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to acomparative example.

FIG. 51 is a schematic cross-sectional view showing a configuration ofpart of a nonvolatile semiconductor memory device according to anotherembodiment.

DETAILED DESCRIPTION

A nonvolatile semiconductor memory device according to an embodimentdescribed below comprises a plurality of conductive layers that arestacked in plurality in a first direction via an inter-layer insulatinglayer, that extend in a second direction which intersects the firstdirection, and that are disposed in plurality in a third direction whichintersects the first direction and the second direction. In addition,the same nonvolatile semiconductor memory device comprises: asemiconductor layer that has the first direction as a longitudinaldirection; a tunnel insulating layer that contacts a side surface of thesemiconductor layer; a charge accumulation layer that contacts a sidesurface of the tunnel insulating layer; and a block insulating layerthat contacts aside surface of the charge accumulation layer.Furthermore, in the same nonvolatile semiconductor memory device, an endin the third direction of the plurality of conductive layers is rounded.

First Embodiment

[Overall Configuration]

A configuration of a nonvolatile semiconductor memory device accordingto a first embodiment will be described below. FIG. 1 is a block diagramof the nonvolatile semiconductor memory device according to the firstembodiment.

As shown in FIG. 1, the nonvolatile semiconductor memory deviceaccording to the first embodiment comprises: a memory cell array 11; rowdecoders 12 and 13; a sense amplifier 14; a column decoder 15; and acontrol signal generating unit 16.

The row decoders 12 and 13, the sense amplifier 14, the column decoder15 and the control signal generating unit 16 control read and write ofthis memory cell array 11; The memory cell array 11 is configured from aplurality of memory blocks MB. Each of the memory blocks MB includes aplurality of memory transistors MTr arranged three-dimensionally thereinand each storing data in a nonvolatile manner. Moreover, the memoryblock MB configures a minimum erase unit of batch erase when executing adata erase operation. The memory transistors MTr are disposed in amatrix (three-dimensionally) in a row direction, a column direction, anda stacking direction.

As shown in FIG. 1, the row decoders 12 and 13 decode the likes of adown-loaded block address signal, and control the memory cell array 11.The sense amplifier 14 reads data from the memory cell array 11. Thecolumn decoder 15 decodes a column address signal and controls the senseamplifier 14. The control signal generating unit 16 boosts a referencevoltage to generate a high voltage required during write or erase, andfurthermore generates a control signal, and controls the row decoders 12and 13, the sense amplifier 14, and the column decoder 15.

Next, a specific configuration of the memory block MB will be describedwith reference to FIG. 2. FIG. 2 is a circuit diagram for explaining thespecific configuration of the memory block MB. The memory block MBincludes a plurality of bit lines BL, a plurality of source lines SL,and a plurality of memory units MU connected to these bit lines BL andsource lines SL.

The memory unit MU configures a NAND type flash memory, and isconfigured having a source side select transistor SSTr and a drain sideselect transistor SDTr respectively connected to both ends of a memorystring MS, the memory string MS being configured from memory transistorsMTr1 to MTr8 and a back gate transistor BTr connected in series. Thememory transistors MTr1 to MTr8 change their threshold voltage byaccumulating a charge in their charge accumulation layer, and store datacorresponding to this threshold voltage.

Drains of the drain side select transistors SDTr of a plurality of thememory units MU aligned in the column direction are connected to acommon bit line BL. Sources of the source side select transistors SSTrof a plurality of the memory units MU aligned in the column directionare connected to a common source line SL. Gates of each of the memorytransistors MTr1 to MTr8 are respectively connected to word lines WL1 toWL8. Aback gate line BG is commonly connected to gates of the back gatetransistors BTr. A source side select gate line SGS is connected togates of the source side select transistors SSTr, and a drain sideselect gate line SGD is connected to gates of the drain side selecttransistors SDTr.

[Memory Cell Array 11]

Next, a structure of the memory cell array 11 according to the firstembodiment will be described with reference to FIGS. 3 to 7. FIG. 3 is aperspective view illustrating part of the memory cell array 11. FIG. 4is a cross-sectional view illustrating part of the memory cell array 11.Moreover, FIG. 5 is an enlarged view of a portion indicated by A of FIG.4; FIG. 6 is an enlarged view of a portion indicated by B of FIG. 4; andFIG. 7 is an enlarged view of a portion indicated by C of FIG. 4.

Note that below, a memory cell array 11 having aMetal/Oxide/Nitride/Oxide/Silicon structure (MONOS structure) or aSilicon/Oxide/Nitride/Oxide/Silicon structure (SONOS structure) will bedescribed as an example. However, it is also possible to adopt a memorycell array having a Floating Gate structure.

As shown in FIG. 3, the memory cell array 11 includes a back gate layer30, a memory layer 40, a select transistor layer 50, and a wiring linelayer 60 that are stacked sequentially on a substrate 20. The back gatelayer 30 functions as the back gate transistor BTr. The memory layer 40functions as the memory transistors MTr1 to MTr8. The select transistorlayer 50 functions as the drain side select transistor SDTr and thesource side select transistor SSTr. The wiring line layer 60 functionsas the source line SL and the bit line BL.

As shown in FIG. 3, the back gate layer 30 includes a back gateconductive layer 31. The back gate conductive layer 31 functions as theback gate line BG and as the gate of the back gate transistor BTr. Theback gate conductive layer 31 is formed so as to extend in a plateshape, two-dimensionally, in the row direction and the column directionparallel to the substrate 20.

As shown in FIG. 4, the back gate layer 30 includes a back gate hole 32.The back gate hole 32 is formed so as to dig in to the back gateconductive layer 31.

As shown in FIGS. 3 and 4, the memory layer 40 is formed in a layerabove the back gate layer 30. The memory layer 40 includes a pluralityof layers (in FIG. 3, four layers) of word line conductive layers 41 ato 41 d. The word line conductive layer 41 a functions as the word lineWL4 and as the gate of the memory transistor MTr4. In addition, the wordline conductive layer 41 a functions as the word line WL5 and as thegate of the memory transistor MTr5. Similarly, the word line conductivelayers 41 b to 41 d respectively function as the word lines WL1 to WL3and WL6 to WL8 and as the gates of the memory transistors MTr1 to MTr3and MTr6 to MTr8. Moreover, as shown in FIG. 4, an inter-layerinsulating layer 42 is formed between the word line conductive layers41, above and below.

The word line conductive layers 41 are disposed with a certain pitch inthe column direction. Moreover, the word line conductive layers 41 areformed so as to extend having the row direction (a directionperpendicular to the plane of paper in FIG. 4) as a longitudinaldirection.

As shown in FIG. 4, the memory layer 40 includes a memory hole MH. Thememory hole MH is formed so as to penetrate the word line conductivelayers 41 a to 41 d and the inter-layer insulating layers 42. The memoryhole MH is formed so as to be aligned with close to an end in the columndirection of the back gate hole 32.

Moreover, as shown in FIG. 4, the back gate layer 30 and the memorylayer 40 comprise a memory semiconductor layer 441. The memorysemiconductor layer 441 functions as a body (channel) of the memorystring MS (memory transistors MTr1 to MTr8) and the back gate transistorBTr.

In addition, as shown in FIG. 5, the back gate layer 30 and the memorylayer 40 include: a tunnel insulating layer 442 that covers the memorysemiconductor layer 441; a charge accumulation layer 443 that covers thetunnel insulating layer 442; and a block insulating layer 444 thatcovers the charge accumulation layer 443. The charge accumulation layer443 is configured capable of accumulating a charge.

As shown in FIG. 4, the memory semiconductor layer 441, the tunnelinsulating layer 442, the charge accumulation layer 443, and the blockinsulating layer 444 are formed so as to fill the back gate hole 32 andthe memory hole MH. The memory semiconductor layer 441 includes a pairof columnar portions 447 extending in a direction perpendicular to thesubstrate 20, and a coupling portion 448 that couples the pair ofcolumnar portions 447 at lower ends thereof. The memory semiconductorlayer 441 is formed in a U shape as viewed from the row direction.

The above-described back gate layer 30 is formed so as to surround aside surface of the coupling portion 448. Moreover, the word lineconductive layers 41 a to 41 d are formed so as to surround a sidesurface of the columnar portion 447.

In addition, as shown in FIG. 3, an upper portion of one of the columnarportions 447 is surrounded by a source side conductive layer 51 afunctioning as the source side select gate line SGS, and functions as achannel of the source side select transistor SSTr. Similarly, an upperportion of the other of the columnar portions 447 is surrounded by adrain side conductive layer 51 b functioning as the drain side selectgate line SGD, and functions as a channel of the drain side selecttransistor SDTr.

Furthermore, as shown in FIG. 3, the upper portion of the one of thecolumnar portions 447 is connected to a source line layer 61 functioningas the source line SL. Moreover, the upper portion of the other of thecolumnar portions 447 is connected, via a plug layer 63, to a bit linelayer 62 functioning as the bit line BL.

In addition, as shown in FIG. 4, the word line conductive layers 41configuring different memory blocks MB are divided in the columndirection via an insulating layer 47. Furthermore, as shown in FIG. 4,the word line conductive layer 41 positioned in a periphery of one ofthe columnar portions 447 and the word line conductive layer 41positioned in a periphery of the other of the columnar portions 447, ofthe pair of columnar portions 447 connected by the coupling portion 448,are divided in the column direction by an insulating layer 46.

As shown in FIG. 6, in a periphery of the insulating layer 47, an end inthe column direction of the word line conductive layer 41 is rounded.That is, a curve 11 joining a tip P1 in the column direction of the wordline conductive layer 41 and an upper surface F1 of the word lineconductive layer 41 is an upwardly convex curve. Similarly, a curve 12joining the tip P1 in the column direction of the word line conductivelayer 41 and a lower surface F2 of the word line conductive layer 41 isa downwardly convex curve. The curves 11 and 12 have a width of 1 nm ormore in the stacking direction. Moreover, in the present embodiment, thecurves 11 and 12 have a curvature, and a radius of curvature of thesecurves 11 and 12 is 20 nm or more. Note that the curves 11 and 12 may becurves approximated to a cross-sectional image of the word lineconductive layer 41.

In addition, as shown in FIG. 6, an oxide portion 411 contacting the tipP1 in the column direction of the word line conductive layer 41 isformed between the word line conductive layer 41 and the insulatinglayer 47.

As shown in FIG. 7, in a periphery of the insulating layer 46, an end inthe column direction of the word line conductive layer 41 is notrounded. That is, an end surface F5 in the column direction of the wordline conductive layer 41 is a planar surface. Moreover, the end surfaceF5 intersects an upper surface F3 of the word line conductive layer 41at substantially a single point P2. Similarly, the end surface F5intersects a lower surface F4 of the word line conductive layer 41 atsubstantially a single point P3. Note that in the present embodiment,the end in the column direction of the word line conductive layer 41 inthe periphery of the insulating layer 46 is not rounded. However, aswill be mentioned later, the end in the column direction of the wordline conductive layer 41 in the periphery of the insulating layer 46 maybe rounded.

[Material of Each Configuration in Memory Cell Array 11]

The back gate conductive layer 31 and the memory semiconductor layer 441are conceivably configured from, for example, a semiconductor such asSi, SiGe, SiC, Ge, C, and so on.

The charge accumulation layer 443 is formed from, for example, siliconnitride (SiN).

The tunnel insulating layer 442 and the block insulating layer 444 areconceivably configured, from, for example, a material such as an oxideor an oxynitride, and so on.

Conceivable as the oxide configuring the tunnel insulating layer 442 andthe block insulating layer 444 are, for example, SiO₂, Al₂O₃, Y₂O₃,La₂O₃, Gd₂O₃, Ce₂O₃, CeO₂, Ta₂O₅, HfO₂, ZrO₂, TiO₂, HfSiO, HfAlO, ZrSiO,ZrAlO, AlSiO, and so on.

Moreover, the oxide configuring the tunnel insulating layer 442 and theblock insulating layer 444 may be AB₂O₄. Note that the A and B referredto here are the same or different elements, and are each one of Al, Sc,Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, and Ge. For example, AB₂O₄ isFe₃O₄, FeAl₂O₄, Mn_(1|x)Al_(2-x)O_(4|y), Co_(1|x)Al_(2-x)O_(4|y),MnO_(x), and so on.

Moreover, the oxide configuring the tunnel insulating layer 442 and theblock insulating layer 444 may be ABO₃. Note that the A and B referredto here are the same or different elements, and are each one of Al, La,Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu,Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn,Ga, Ge, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, and Sn. For example,ABO₃ is LaAlO₃, SrHfO₃, SrZrO₃, SrTiO₃, and so on.

Conceivable as the oxynitride configuring the tunnel insulating layer442 and the block insulating layer 444 are, for example, SiON, AlON,YON, LaON, GdON, CeON, TaON, HfON, ZrON, TiON, LaAlON, SrHfON, SrZrON,SrTiON, HfSiON, HfAlON, ZrSiON, ZrAlON, AlSiON, and so on.

Moreover, the oxynitride configuring the tunnel insulating layer 442 andthe block insulating layer 444 may be a material in which an oxygenelement portion of each of the materials described above as the oxideconfiguring the tunnel insulating layer 442 and the block insulatinglayer 444 is substituted by a nitrogen element.

Note that the following are preferred as the material of the tunnelinsulating layer 442 and the block insulating layer 444, namely, SiO₂,SiN, Si₃N₄, Al₂O₃, SiON, HfO₂, HfSiON, Ta₂O₅, TiO₂, or SrTiO₃.

In particular, an Si based insulating film such as SiO₂, SiN, SiON, andso on, includes one in which concentrations of oxygen elements ornitrogen elements are each 1×10¹⁰ atoms/cm³ or more. Note that barrierheights of a plurality of insulating layers differ from each other.

Moreover, the tunnel insulating layer 442 and the block insulating layer444 may include impurity atoms forming a defect level, orsemiconductor/metal dots (quantum dots).

The word line conductive layer 41 and the bit line layer 62 areconceivably configured, from, for example, a conductive layer of thelikes of W, WN, Al, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, TiN, WSi_(x),TaSi_(x), PdSi_(x), ErSi_(x), YSi_(x), PtSi_(x), HfSi_(x), NiSi_(x),CoSi_(x), TiSi_(x), VSi_(x), CrSi_(x), MnSi_(x), FeSi_(x), and so on.

The insulating layer 46 and the insulating layer 47 are formed from, forexample, silicon oxide (SiO₂) or silicon nitride (SiN), and so on.

The oxide portion 411 is configured from a material having insulationproperties and obtained by oxidizing the material configuring the wordline conductive layer 41.

[Operation]

Next, operation of the nonvolatile semiconductor memory device accordingto the present embodiment will be described with reference to FIGS. 8 to11. FIGS. 8 and 9 are schematic views for explaining a write operationof the nonvolatile semiconductor memory device according to the presentembodiment.

As shown in FIG. 8, in the write operation, first, a voltage of the bitline BL is set to a bit line voltage Vbl. A voltage of the drain sideselect gate line SGD is set to Voff. Voltages of the word lines WL areall set to a boost voltage Vdd. A voltage of the source side select gateline SGS is set to Von. A voltage of the source line SL is set to asource line voltage Vsl. As a result, a channel is formed in the memorysemiconductor layer 441 (FIG. 3), and the source line SL is electricallyconnected to the semiconductor layer 441 via the source side selecttransistor SSTr (FIG. 3).

Now, the bit line voltage Vbl is, for example, about 0.5 V. Moreover,the boost voltage Vdd is a voltage large enough to set the memorytransistor MTr to an ON state regardless of a charge accumulated in thecharge accumulation layer 443 of the memory transistor MTr. In addition,the boost voltage Vdd is a voltage of a degree substantially preventingoccurrence of accumulation of charge to the charge accumulation layer443 of the memory transistor MTr. Moreover, the source line voltage Vslis, for example, a ground voltage.

Next, as shown in FIG. 9, a voltage of a selected word line WLtconnected to a selected memory transistor MTrt that is to undergo awrite is set to a program voltage Vpgm, and a voltage of another wordline WL is set to a write pass voltage Vpass. A voltage of a selectedsource side select gate line SGSt connected to the selected memorytransistor MTrt is set to Von, and a voltage of another source sideselect gate line SGS is set to Voff. As a result, electrons are suppliedfrom the source line SL to the semiconductor layer 441 (FIG. 3), andelectrons are injected into the charge accumulation layer 443 (FIG. 5)of the selected memory transistor MTrt via the tunnel insulating layer442 (FIG. 5) and stored in the charge accumulation layer 443.

Now, the program voltage Vpgm is a voltage large enough for a charge tobe accumulated in the charge accumulation layer 443 of the memorytransistor MTr. In addition, the read pass voltage Vread is a voltage ofa degree substantially preventing occurrence of accumulation of chargeto the charge accumulation layer 443 of the memory transistor MTr.

FIG. 10 is a schematic view for explaining a read operation of thenonvolatile semiconductor memory device according to the presentembodiment.

As shown in FIG. 10, in the read operation, first, a voltage of the bitline BL is set to the bit line voltage Vbl. A voltage of a selecteddrain side select gate line SGDt connected to a selected memorytransistor MTrt that is to undergo the read operation is set to Von, anda voltage of another drain side select gate line SGD is set to Voff. Avoltage of a selected word line WLt connected to the selected memorytransistor MTrt is set to a read voltage Vsense, and a voltage ofanother word line WL is set to a read pass voltage Vread. A voltage of aselected source side select gate line SGSt connected to the selectedmemory transistor MTrt is set to Von, and a voltage of another sourceside select gate line SGS is set to Voff. A voltage of the source lineSL is set to the source line voltage Vsl.

As a result, a channel is formed in the semiconductor layer 441 (FIG.3), and the source line SL is electrically connected to thesemiconductor layer 441 via the source side select transistor SSTr (FIG.3). Moreover, the selected memory transistor MTrt attains an ON state oran OFF state depending on data stored therein. Therefore, by detecting acurrent or voltage of the bit line BL, it is possible to determine datastored by the selected memory transistor MTrt.

Now, the read voltage Vsense is a voltage for determining a chargeaccumulated in the charge accumulation layer 443 of the selected memorytransistor MTrt. Therefore, the selected memory transistor MTrt appliedwith the read voltage Vsense via the selected word line WLt attains anON state or attains an OFF state depending on an amount of chargeaccumulated in the charge accumulation layer 443. Moreover, if, forexample, each of the memory transistors MTr stores multi-value data, theread voltage Vsense is set in a plurality of stages.

The read pass voltage Vread is a voltage large enough to set the memorytransistor MTr to an ON state regardless of a charge accumulated in thecharge accumulation layer 443 of the memory transistor MTr. Therefore,the read pass voltage Vread is larger than the read voltage Vsense.Moreover, the read pass voltage Vread is a voltage of a degreesubstantially preventing occurrence of accumulation of charge to thecharge accumulation layer 443 of the memory transistor MTr. Therefore,the read pass voltage Vread is smaller than the above-mentioned programvoltage Vpgm. The read pass voltage Vread is, for example, about 6 V.

FIG. 11 is a schematic view for explaining an erase operation of thenonvolatile semiconductor memory device according to the presentembodiment. As shown in FIG. 11, in the erase operation, first, avoltage of the bit line BL is set to the bit line voltage Vbl. A voltageof a selected drain side select gate line SGDt connected to a selectedmemory transistor MTrt that is to undergo the erase operation is set toVerag, and another drain side select gate line SGD is set to a floatingstate. A voltage of a selected word line WLt connected to the selectedmemory transistor MTrt is set to a ground voltage Vss, and another wordline WL is set to a floating state. A voltage of a selected source sideselect gate line SGSt connected to the selected memory transistor MTrtis set to Verag, and another source side select gate line SGS is set toa floating state. A voltage of the source line SL is set to the sourceline voltage Vsl. As a result, electrons are extracted from the chargeaccumulation layer 443 (FIG. 5) of the selected memory transistor MTrtinto the semiconductor layer 441 (FIG. 3) via the tunnel insulatinglayer 442 (FIG. 5). Now, as shown in FIG. 11, Verag is, for example,about −7 V to −8 V.

Nonvolatile Semiconductor Memory Device According to Comparative Example

Next, a configuration of a nonvolatile semiconductor memory deviceaccording to a comparative example will be described with reference toFIG. 12. FIG. 12 is a cross-sectional view showing a configuration ofpart of the nonvolatile semiconductor memory device according to thecomparative example.

As shown in FIG. 12, in the nonvolatile semiconductor memory deviceaccording to the comparative example, the end in the column direction ofa word line WL′ in the periphery of the insulating layer 47 is notrounded. That is, an end surface F6 in the column direction of the wordline conductive layer 41 is a planar surface. Moreover, the end surfaceF6 intersects an upper surface F1′ of the word line conductive layer 41at substantially a single point P4. Similarly, the end surface F6intersects a lower surface F2′ of the word line conductive layer 41 atsubstantially a single point P5.

The end of the word line WL′ according to the comparative example is notrounded. Therefore, an electric field easily concentrates in the end ofthe word line WL′ according to the comparative example. Therefore,sometimes, when word lines WL′ adjacent in the stacking direction areapplied with different voltages, an electric field concentrates between,for example, an upper end P4 of the end surface F6 of a downwardlypositioned word line WL′ and a lower end P5 of the end surface F6 of anupwardly positioned word line WL′, and a leak current ends up flowing.

Comparison of Nonvolatile Semiconductor Memory Device According toPresent Embodiment and Comparative Example

As shown in FIG. 6, in the present embodiment, the end in the columndirection of the word line WL is rounded, hence a distance betweenfellow tips P1 in the column direction in two of the word lines WLadjacent in the stacking direction, increases. Therefore, it is possibleto ease a voltage between, for example, the tip P1 of a downwardlypositioned word line WL and the tip P1 of an upwardly positioned wordline WL, and suppress occurrence of a leak current.

Moreover, as shown in FIG. 6, in the present embodiment, the tips P1 inthe column direction of the word lines WL each have a curvature.Therefore, it is possible to further prevent concentration of anelectric field and suppress occurrence of a leak current, compared to inthe comparative example.

[Method of Manufacturing]

Next, a method of manufacturing the nonvolatile semiconductor memorydevice according to the present embodiment will be described withreference to FIGS. 13 to 22. FIGS. 13 to 22 are cross-sectional viewsfor explaining the method of manufacturing the same nonvolatilesemiconductor memory device.

As shown in FIG. 13, the back gate conductive layer 31 and an insulatinglayer 33 are stacked above a substrate not illustrated, and a pluralityof conductive layers 41A which will be the word line conductive layers41, and inter-layer insulating layers 42 are stacked thereon.

Next, as shown in FIG. 14, an opening op1 penetrating each of the layersin the stacking direction is formed on the configuration shown in FIG.13. The opening op1 will be the memory hole MH shown in FIG. 4.Moreover, as shown in FIG. 14, two adjacent openings op1 are incommunication at lower ends thereof.

Next, as shown in FIG. 15, the memory semiconductor layer 441 is formedin the opening op1. At this time, the tunnel insulating layer 442, thecharge accumulation layer 443, and the block insulating layer 444described with reference to FIG. 5 are also formed, although this is notillustrated in FIG. 15. As a result, the inside of the opening op1 isfilled.

Next, as shown in FIG. 16, the stacked plurality of conductive layers41A and inter-layer insulating layers 42 are divided in the columndirection. A slit (trench) dividing these layers is referred to below asan opening op2. The opening op2 is formed between the pair of columnarportions 447 whose lower ends are coupled by the coupling portion 448,and divides in the column direction the conductive layer 41A positionedin a periphery of one of the columnar portions 447 and the conductivelayer 41A positioned in a periphery of the other of the columnarportions 447. Note that formation of the opening op2 is performed by,for example, a means such as RIE (Reactive Ion Etching), or the like.

Next, as shown in FIG. 17, the insulating layer 46 is filled into theopening op2.

Next, as shown in FIGS. 18 and 19, the stacked plurality of conductivelayers 41A and inter-layer insulating layers 42, and the insulatinglayer 33 are divided in the column direction. A slit (trench) dividingthese layers is referred to below as an opening op3. The opening op3divides in the column direction the conductive layers 41A which will bethe word line conductive layers 41 configuring different memory blocksMB. Note that formation of the opening op3 is performed by, for example,a means such as RIE, or the like.

At this time, as shown in FIG. 19, an end surface F6A exposed in theopening op3 of the conductive layer 41A is flat. Moreover, the endsurface F6A intersects an upper surface F1′ of the conductive layer 41Aat substantially a single point P4. Similarly, the end surface F6Aintersects a lower surface F2′ of the conductive layer 41A atsubstantially a single point P5.

Next, as shown in FIG. 20, an oxidation treatment is performed. As aresult, as shown in FIG. 20, the end exposed in the opening op3 of theconductive layer 41A is oxidized to become the oxide portion 411.Oxidation of an end of the conductive layer 41A proceeds comparativelyquickly in a portion close to the opening op3 and close to the uppersurface F1′ and the lower surface F2′, of the conductive layer 41A.Therefore, as shown in FIG. 20, the word line conductive layer 41 isrounded by the oxidation treatment. That is, the curve 11 joining thetip P1 in the column direction of the word line conductive layer 41 andthe upper surface F1 of the word line conductive layer 41 becomes anupwardly convex curve. Similarly, the curve 12 joining the tip P1 in thecolumn direction of the word line conductive layer 41 and the lowersurface F2 of the word line conductive layer 41 becomes a downwardlyconvex curve. Note that in the present embodiment, the curves 11 and 12have a width of 1 nm or more in the stacking direction. Moreover, in thepresent embodiment, the curves 11 and 12 have a curvature, and a radiusof curvature of these curves 11 and 12 is 20 nm or more.

Note that the oxidation treatment is performed by, for example, a methodemploying plasma such as SPA (Slot Plane Antenna) plasma oxidation, andso on, or a method such as wet oxidation using water vapor, dryoxidation using an oxygen based gas, RTO (Rapid Thermal Oxidation),radical oxidation, and so on.

Next, as shown in FIGS. 21 and 22, the insulating layer 47 is filledinto the opening op3.

Subsequently, the likes of the select transistor layer 50 and the wiringline layer 60 described with reference to FIGS. 3 and 4 are formed,whereby the nonvolatile semiconductor memory device according to thepresent embodiment can be manufactured.

Second Embodiment

Next, a method of manufacturing a nonvolatile semiconductor memorydevice according to a second embodiment will be described with referenceto FIGS. 23 and 24. FIGS. 23 and 24 are cross-sectional views showingthe same method of manufacturing. Note that in the description below,portions similar to those in the first embodiment are assigned withreference symbols similar to those assigned in the first embodiment, anddescriptions of said portions will be omitted.

The nonvolatile semiconductor memory device according to the presentembodiment is basically configured similarly to the nonvolatilesemiconductor memory device according to the first embodiment, but someof the manufacturing processes thereof are different. Moreover, themethod of manufacturing the nonvolatile semiconductor memory deviceaccording to the present embodiment is performed similarly to the methodof manufacturing according to the first embodiment up to the processesdescribed with reference to FIGS. 18 and 19.

As shown in FIG. 23, in the present embodiment, an insulating layer 431is formed inside the opening op3. The insulating layer 431 covers theend P1A of the plurality of conductive layers 41A exposed in the openingop3, and has a film thickness of a degree not filling in all of theinside of the opening op3.

Next, as shown in FIG. 24, an oxidation treatment is performed. As aresult, as shown in FIG. 24, part of the end P1A of the conductive layer41A is oxidized to become an oxide portion 43′. Moreover, similarly toin the first embodiment, the end of the word line conductive layer 41 isrounded by the oxidation treatment. Note that the oxidation treatmentcan be performed by, for example, the variety of methods described withreference to FIG. 20.

Subsequently, the insulating layer 47 is filled into the opening op3,and the likes of the select transistor layer 50 and the wiring linelayer 60 described with reference to FIGS. 3 and 4 are formed, wherebythe nonvolatile semiconductor memory device according to the presentembodiment can be manufactured.

Third Embodiment

Next, a nonvolatile semiconductor memory device according to a thirdembodiment will be described with reference to FIG. 25. FIG. 25 is aschematic cross-sectional view showing a configuration of part of thenonvolatile semiconductor memory device according to the thirdembodiment. Note that in the description below, portions similar tothose in the first embodiment are assigned with reference symbolssimilar to those assigned in the first embodiment, and descriptions ofsaid portions will be omitted.

The nonvolatile semiconductor memory device according to the presentembodiment is basically configured similarly to the nonvolatilesemiconductor memory device according to the first embodiment, but amode of the end in the column direction of the word line conductivelayer 41 in the periphery of the insulating layer 46 is different. Thatis, as shown in FIG. 7, in the first embodiment, the end in the columndirection of the word line conductive layer 41 in the periphery of theinsulating layer 46 was not rounded.

In contrast, in the present embodiment, as shown in FIG. 25, the end inthe column direction of the word line conductive layer 41 in theperiphery of the insulating layer 46 is configured as a silicide portion412. An end in the column direction of the silicide portion 412 isrounded. That is, a curve 13 joining a tip P6 in the column direction ofthe silicide portion 412 and an upper surface F3′ of the word lineconductive layer 41 is an upwardly convex curve. Similarly, a curve 14joining the tip P6 in the column direction of the silicide portion 412and a lower surface F4′ of the word line conductive layer 41 is adownwardly convex curve. The curves 13 and 14 have a width of 1 nm ormore in the stacking direction. Moreover, in the present embodiment, thecurves 13 and 14 have a curvature, and a radius of curvature of thesecurves 13 and 14 is 20 nm or more. Note that the curves 13 and 14 may becurves approximated to a cross-sectional image of the word lineconductive layer 41.

Note that the silicide portion 412 is conceivably configured from, forexample, a silicide including Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Rh,Pd, Ag, Cd, In, Sn, La, Hf, Ta, W, Re, Os, Ir, Pt, or Au. In addition,the silicide portion 412 may be configured from, for example, such asilicide having added thereto one element or two or more elementsselected from Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Y, Zr, Nb, Mo, Tc, Ru,Rh, Pd, Ag, Cd, In, Sn, La, Hf, Ta, W, Re, Os, Ir, Pt, or Au.

Moreover, as shown in FIG. 25, an oxide-silicide portion 413 contactingthe silicide portion 412 is formed between the silicide portion 412 andthe insulating layer 46. The oxide-silicide portion 413 protrudesfurther to an insulating layer 46 side, compared to the inter-layerinsulating layer 42. Note that the oxide-silicide portion 413 isconfigured from, for example, a material having insulation propertiesand obtained by oxidizing a material configuring the silicide portion412.

Next, a method of manufacturing the nonvolatile semiconductor memorydevice according to the present embodiment will be described withreference to FIGS. 26 and 27. FIGS. 26 and 27 are cross-sectional viewsfor explaining the method of manufacturing the nonvolatile semiconductormemory device according to the present embodiment.

The method of manufacturing the nonvolatile semiconductor memory deviceaccording to the present embodiment is performed similarly to the methodof manufacturing according to the first embodiment up to the processdescribed with reference to FIG. 16.

As shown in FIG. 26, in the present embodiment, an end P4A′ of theplurality of conductive layers 41A exposed in the opening op2 issilicided to form a silicide portion 412A. The silicide portion 412Aprotrudes further in a direction toward the inside of the opening op2,compared to the inter-layer insulating layer 42.

Next, as shown in FIG. 27, an oxidation treatment is performed. As aresult, as shown in FIG. 27, part of the silicide portion 412A isoxidized to become the oxide-silicide portion 413. Moreover, the end ofthe silicide portion 412 is rounded by the oxidation treatment. That is,the curve 13 joining the tip P6 in the column direction of the silicideportion 412 and the upper surface F3′ of the word line conductive layer41 becomes an upwardly convex curve. Similarly, the curve 14 joining thetip P6 in the column direction of the silicide portion 412 and the lowersurface F4′ of the word line conductive layer 41 becomes a downwardlyconvex curve. The curves 13 and 14 have a width of 1 nm or more in thestacking direction. Moreover, in the present embodiment, the curves 13and 14 have a curvature, and a radius of curvature of these curves 13and 14 is 20 nm or more. Note that the oxidation treatment can beperformed by, for example, the variety of methods described withreference to FIG. 20.

Subsequently, each of the processes described with reference to FIGS. 17to 22 is performed, and, furthermore, the likes of the select transistorlayer 50 and the wiring line layer 60 described with reference to FIGS.3 and 4 are formed, whereby the nonvolatile semiconductor memory deviceaccording to the present embodiment can be manufactured.

Fourth Embodiment

Next, a method of manufacturing a nonvolatile semiconductor memorydevice according to a fourth embodiment will be described with referenceto FIGS. 28 and 29. FIGS. 28 and 29 are cross-sectional views showingthe same method of manufacturing. Note that in the description below,portions similar to those in the third embodiment are assigned withreference symbols similar to those assigned in the third embodiment, anddescriptions of said portions will be omitted.

The nonvolatile semiconductor memory device according to the presentembodiment is basically configured similarly to the nonvolatilesemiconductor memory device according to the third embodiment, but someof the manufacturing processes thereof are different. The method ofmanufacturing the nonvolatile semiconductor memory device according tothe present embodiment is performed similarly to the method ofmanufacturing according to the third embodiment up to the processdescribed with reference to FIG. 26.

As shown in FIG. 28, in the present embodiment, an insulating layer 416is formed inside the opening op2. The insulating layer 416 covers theend of the plurality of silicide portions 412A exposed in the openingop2, and has a film thickness of a degree not filling in all of theinside of the opening op2.

Next, as shown in FIG. 29, an oxidation treatment is performed. As aresult, as shown in FIG. 29, part of the end of the silicide portion412A is oxidized to become the oxide-silicide portion 413. Moreover, theend of the silicide portion 412 is rounded by the oxidation treatment.Note that the oxidation treatment can be performed by, for example, thevariety of methods described with reference to FIG. 20.

Subsequently, each of the processes described with reference to FIGS. 17to 22 is performed, and, furthermore, the likes of the select transistorlayer 50 and the wiring line layer 60 described with reference to FIGS.3 and 4 are formed, whereby the nonvolatile semiconductor memory deviceaccording to the present embodiment can be manufactured.

Fifth Embodiment

Next, a nonvolatile semiconductor memory device according to a fifthembodiment will be described with reference to FIG. 30. FIG. 30 is aschematic cross-sectional view showing a configuration of part of thenonvolatile semiconductor memory device according to the fifthembodiment. Note that in the description below, portions similar tothose in the third embodiment are assigned with reference symbolssimilar to those assigned in the third embodiment, and descriptions ofsaid portions will be omitted.

The nonvolatile semiconductor memory device according to the presentembodiment is basically configured similarly to the nonvolatilesemiconductor memory device according to the third embodiment, but asshown in FIG. 30, in the present embodiment, the silicide portion 412contacts the insulating layer 46 at a tip P6′ in the column direction.Moreover, a curved portion joining the tip P6′ and the upper surface F3′of the word line conductive layer 41 contacts an oxide portion 415.Similarly, a curved portion joining the tip P6′ and the lower surfaceF4′ of the word line conductive layer 41 contacts the oxide portion 415.

Next, a method of manufacturing the nonvolatile semiconductor memorydevice according to the present embodiment will be described withreference to FIGS. 31 to 33. FIGS. 31 to 33 are cross-sectional viewsfor explaining the method of manufacturing the nonvolatile semiconductormemory device according to the present embodiment.

The method of manufacturing the nonvolatile semiconductor memory deviceaccording to the present embodiment is performed similarly to the methodof manufacturing according to the first embodiment up to the processdescribed with reference to FIG. 16.

As shown in FIG. 31, in the present embodiment, an oxidation treatmentis performed. As a result, as shown in FIG. 31, part of the end exposedin the opening op2 of the conductive layer 41A is oxidized to become theoxide portion 415. Oxidation of the end of the conductive layer 41Aproceeds comparatively quickly in a portion close to the opening op2 andclose to the upper surface and the lower surface, of the conductivelayer 41A. Therefore, as shown in FIG. 31, the end of the conductivelayer 41A is rounded by the oxidation treatment. Note that the oxidationtreatment can be performed by, for example, the variety of methodsdescribed with reference to FIG. 20.

Next, as shown in FIG. 32, part of the inter-layer insulating layer 42and the oxide portion 415 is removed via the opening op2, and theconductive layer 41A is exposed in the opening op2.

Next, as shown in FIG. 33, a tip P4 of the plurality of conductivelayers 41A exposed in the opening op2 is silicided to form the silicideportion 412.

Subsequently, each of the processes described with reference to FIGS. 17to 22 is performed, and, furthermore, the likes of the select transistorlayer 50 and the wiring line layer 60 described with reference to FIGS.3 and 4 are formed, whereby the nonvolatile semiconductor memory deviceaccording to the present embodiment can be manufactured.

Sixth Embodiment

[Configuration]

Next, a nonvolatile semiconductor memory device according to a sixthembodiment will be described with reference to FIGS. 34 to 36. FIG. 34is a perspective view showing a structure of part of a memory cell array11′ according to the present embodiment; FIG. 35 is an equivalentcircuit diagram of one NAND cell unit NU; and FIG. 36 is across-sectional view of the memory cell array 11′.

In the first through fifth embodiments, as described with reference to,for example, FIGS. 3 and 4, the memory semiconductor layer 441 includesthe pair of columnar portions 447 extending in the directionperpendicular to the substrate 20 and the coupling portion 448 couplingthe pair of columnar portions 447 at lower ends thereof, and is formedin a U shape as viewed from the row direction. In contrast, as shown inFIGS. 34 to 36, the present embodiment adopts a configuration of a kindin which the semiconductor layers 441 are not coupled at lower endsthereof.

As shown in FIG. 34, the memory cell array 11′ according to the presentembodiment has a structure in which inter-layer insulating layers 22 andconductive layers 21 are stacked alternately on a semiconductorsubstrate SB. This conductive layer 21 functions as a control gate of amemory cell MC (word line WL), as a source side select gate line SGS,and as a drain side select gate line SGD. The inter-layer insulatinglayer 22 is disposed above and below these conductive layers 21, andelectrically insulates fellow conductive layers 21.

The conductive layer 21 may be formed by, for example, tungsten (W),tungsten nitride (WN), tungsten silicide (WSix), tantalum (Ta), tantalumnitride (TaN), tantalum silicide (TaSix), palladium silicide (PdSix),erbium silicide (ErSix), yttrium silicide (YSix), platinum silicide(PtSix), hafnium silicide (HfSix), nickel silicide (NiSix), cobaltsilicide (CoSix), titanium silicide (TiSix), vanadium silicide (VSix),chromium silicide (CrSix), manganese silicide (MnSix), iron silicide(FeSix), ruthenium (Ru), molybdenum (Mo), titanium (Ti), titaniumnitride (TiN), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe),cobalt (Co), nickel (Ni), gold (Au), silver (Ag), or copper (Cu), or acompound thereof, but may be formed by polysilicon to which an impurityhas been added.

As shown in FIG. 36, a stacking film CF is formed in a periphery of theconductive layer 21. The stacking film CF is configured from a blockhigh dielectric layer and a barrier metal.

Moreover, as shown in FIG. 36, the conductive layer 21 is divided in theY direction via a later-described source contact LI. Furthermore, an endin a Y direction of the conductive layer 21 (an end facing the sourcecontact LI) is rounded. That is, a curve 110 joining a tip P10 in the Ydirection of the conductive layer 21 and an upper surface F10 of theconductive layer 21 is an upwardly convex curve. Similarly, a curve 111joining the tip P10 in the Y direction of the conductive layer 21 and alower surface F11 of the conductive layer 21 is a downwardly convexcurve. The curves 110 and 111 have a width of 1 nm or more in a stackingdirection. Moreover, in the present embodiment, the curves 110 and 111have a curvature, and a radius of curvature of these curves 110 and 111is 20 nm or more. Note that the curves 110 and 111 may be curvesapproximated to a cross-sectional image of the conductive layer 21.

In addition, as shown in FIG. 36, an oxide portion 211 contacting thetip P10 in the Y direction of the conductive layer 21 is formed betweenthe conductive layer 21 and a later-described inter-layer insulatinglayer LII.

Moreover, as shown in FIG. 36, a memory hole MH is formed in such aninter-layer insulating layer 22 and conductive layer 21 so as topenetrate a stacked body of the inter-layer insulating layer 22 andconductive layer 21. The memory holes MH are arranged with a certainpitch in an XY plane. Moreover, formed in the memory hole MH,sequentially from a center thereof, are a core insulating layer 28, asemiconductor layer 23, and a memory layer 24 that have the stackingdirection (a Z direction) as a longitudinal direction. As will bementioned later, the semiconductor layer 23 is configured from the likesof polysilicon. The memory layer 24 may be formed from a stackedstructure of a charge accumulation layer of the likes of a siliconnitride layer, and an oxide layer of the likes of a silicon oxide layer.A threshold voltage of the memory cell MC changes by an accumulatedamount of charge to this charge accumulation layer, and the memory cellMC stores data corresponding to this threshold voltage.

The semiconductor layer 23 is connected to a bit line BL via a contactCb at an upper end of the semiconductor layer 23. The bit lines BL arearranged with a certain pitch in an X direction, and have the Ydirection as a longitudinal direction.

Moreover, a lower end of the semiconductor layer 23 is connected to thesemiconductor substrate SB. The lower end of the semiconductor layer 23is connected to a source line SL via this semiconductor substrate SB andthe source contact LI. The source lines SL are arranged having the Ydirection as a longitudinal direction, similarly to the bit lines BL.

Note that the stacked body of the inter-layer insulating layer 22 andconductive layer 21 in the memory cell array 11′ is divided on a blockbasis, the block being a minimum unit of data erase. A trench Tb isformed at a boundary of division, and this trench Tb has the inter-layerinsulating layer LII (FIG. 34) implanted therein, and has thepreviously-mentioned source contact LI further formed thereinpenetrating the inter-layer insulating layer LII. This source contact LIhas its lower end connected to the semiconductor substrate SB and itsupper end connected to the source line SL.

FIG. 35 is an equivalent circuit diagram of one NAND cell unit NU. Inthis memory cell array 11′, one NAND cell unit NU comprises: a memorystring MS configured from a plurality of the memory cells MC, a dummycell DMC1, and a dummy cell DMC2; a drain side select transistor Siconnected between an upper end of the memory string MS and the bit lineBL; and a source side select transistor S2 connected between a lower endof the memory string MS and the source line SL.

[Method of Manufacturing]

Next, a method of manufacturing the nonvolatile semiconductor memorydevice according to the sixth embodiment will be described withreference to FIGS. 37 to 44. FIGS. 37 to 44 are cross-sectional viewsfor explaining the method of manufacturing according to the sixthembodiment.

As shown in FIG. 37, an insulating layer 25 is stacked on thesemiconductor substrate SB. In addition, a plurality of sacrifice layers29 and the inter-layer insulating layers 22 are stacked alternately onthe insulating layer 25. Note that the insulating layer 25 and theinter-layer insulating layer 22 are formed from, for example, siliconoxide (SiO₂). Moreover, the sacrifice layer 29 is formed from, forexample, silicon nitride (SiN).

Next, as shown in FIG. 38, an opening op4 penetrating the insulatinglayer 25, the sacrifice layer 29, and the inter-layer insulating layer22 is formed. The opening op4 will be the memory hole MH.

Next, as shown in FIG. 39, a memory layer formation layer 24A which willbe the memory layer 24 and a semiconductor layer formation layer 23Awhich will be the semiconductor layer 23 are formed in the opening op4.

Next, as shown in FIG. 40, the memory layer formation layer 24A and thesemiconductor layer formation layer 23A are removed at the bottom of theopening op4.

Next, as shown in FIG. 41, a semiconductor and the core insulating layer28 are further formed in the opening op4. As a result, the semiconductorlayer 23 electrically connected to the semiconductor substrate SB isformed. The core insulating layer 28 is formed from, for example,silicon oxide (SiO₂).

Next, as shown in FIG. 42, an opening op5 dividing the insulating layer25, the sacrifice layer 29, and the inter-layer insulating layer 22 isformed. The opening op5 will be the trench Tb.

Next, as shown in FIG. 43, the sacrifice layer 29 is removed via theopening op5. Removal of the sacrifice layer 29 is performed by, forexample, wet etching using a phosphoric acid solution. As a result, anair gap AG is formed between the inter-layer insulating layers 22.

Next, as shown in FIG. 44, a stacking film CFA which will be thestacking film CF and a conductive layer 21A which will be the conductivelayer 21 (word line WL) are formed via the opening op5.

Next, as shown in FIG. 45, the stacking film CFA and the conductivelayer 21A in the opening op5 are partially removed, and an oxidationtreatment is performed. As a result, as shown in FIG. 45, an end exposedin the opening op5 of the conductive layer 21A is oxidized to become theoxide portion 211. Oxidation of the end of the conductive layer 21Aproceeds comparatively quickly in a portion close to the opening op5 andclose to the upper surface F10 and the lower surface F11, of theconductive layer 21A. Therefore, as shown in FIG. 36, the conductivelayer 21A is rounded by the oxidation treatment. That is, the curve 110joining the tip P10 in the Y direction of the conductive layer 21A andthe upper surface F10 of the conductive layer 21A becomes an upwardlyconvex curve. Similarly, the curve 111 joining the tip P10 in the Ydirection of the conductive layer 21A and the lower surface F11 of theconductive layer 21A becomes a downwardly convex curve. Note that in thepresent embodiment, the curves 110 and 111 have a width of 1 nm or morein the stacking direction. Moreover, in the present embodiment, thecurves 110 and 111 have a curvature, and a radius of curvature of thesecurves 110 and 111 is 20 nm or more.

Subsequently, the inter-layer insulating layer LII and the sourcecontact LI are formed in the opening op5, whereby the nonvolatilesemiconductor memory device of the kind shown in FIGS. 34 and 36 isformed.

OTHER EMBODIMENTS

In the third through fifth embodiments, similarly to in the firstembodiment, the end in the column direction of the word line conductivelayer 41 in the periphery of the insulating layer 47 is rounded as shownin FIG. 6.

However, in, for example, the third through fifth embodiments, similarlyto in the comparative example described with reference to FIG. 12, theend in the column direction of the word line conductive layer 41 in theperiphery of the insulating layer 47 need not be rounded.

Furthermore, in the first through fifth embodiments, an end in thecolumn direction of the source side conductive layer S1 a or drain sideconductive layer S1 b described with reference to FIGS. 3 and 4 may berounded.

Moreover, as shown in FIG. 46, an end surface F6″ in the columndirection of the word line conductive layer 41 may be formedsubstantially flatly. Furthermore, as shown in FIG. 46, a curve 11′joining the end surface F6′ and an upper surface F1″ of the word lineconductive layer 41 may be configured as an upwardly convex curve.Similarly, a curve 12″ joining the end surface F6″ and a lower surfaceF2″ of the word line conductive layer 41 may be configured as adownwardly convex curve.

Moreover, as shown in FIG. 47, the curve 11″ joining the end surface F6″and the upper surface F1″ may be configured as an upwardly convex curve,and the end surface F6″ and the lower surface F2″ may be configured tointersect at substantially a single point P5. Similarly, the curve 12″joining the end surface F6″ and the lower surface F2″ may be configuredas a downwardly convex curve, and the end surface F6′ and the uppersurface F1′ may be configured to intersect at substantially a singlepoint.

Moreover, as shown in, for example, FIG. 6, in the first through fifthembodiments, the curves 11 and 12 of the end, among the stackedplurality of word line conductive layers 41, each had a substantiallyequal curvature.

However, as shown in, for example, FIG. 48, it is possible to configuresuch that the more upwardly positioned the word line conductive layer 41is, the larger the radius of curvature of the curves 11 and 12 is, andthe more downwardly positioned the word line conductive layer 41 is, thesmaller the radius of curvature of the curves 11 and 12 is. In thiscase, the oxidation treatment is conceivably performed by the likes ofdry oxidation or radical oxidation.

Moreover, as shown in, for example, FIG. 49, it is possible to configuresuch that the more upwardly positioned the word line conductive layer 41is, the smaller the radius of curvature of the curves 11 and 12 is, andthe more downwardly positioned the word line conductive layer 41 is, thelarger the radius of curvature of the curves 11 and 12 is. Such a modemakes it possible to particularly prevent concentration of an electricfield in a downward region where a width in the column direction of theinsulating layer 47 narrows, and suitably suppress occurrence of a leakcurrent. Note that in this case, the oxidation treatment is conceivablyperformed by a method using a cover film of poor coverage and wetoxidation, or the like.

Moreover, as shown in, for example, FIG. 50, sometimes, roughness of theend surface F6 in the column direction of the word line conductive layer41 ends up increasing during division, and so on, and a protrudingportion 417 gets formed in the end surface F6 in the column direction.Sometimes, in this case, due to presence of the protruding portion 417,concentration of an electric field between two of the word lineconductive layers 41 adjacent in the stacking direction furtherintensifies, and it ends up getting easier for a leak current to occur.Moreover, in the case that, for example, the word line conductive layer41 has been doped with boron (B), boron sometimes ends up migrating toother configurations.

However, when an oxidation treatment has been performed on the endsurface F6 in the column direction of the word line conductive layer 41as shown in FIG. 51, it is possible to eliminate the influence ofroughness of the end surface F6, thereby suppressing the above-mentionedkind of concentration of electric field and suppress occurrence of aleak current. Moreover, in the case that, for example, the word lineconductive layer 41 has been doped with boron (B), boron concentrationin the oxide portion 411 rises compared to boron concentration in theinsulating layer 47. Therefore, it is possible to prevent migration ofboron from the word line conductive layer 41 to other configurations.

Note that FIGS. 46 to 51 described the end in the column direction ofthe word line conductive layer 41 in the periphery of the insulatinglayer 47. However, each of the modes described with reference to FIGS.46 to 51 may also be adopted for the end in the column direction of theword line conductive layer 41 in the periphery of the insulating layer46.

Similarly, FIGS. 46 to 51 described the example in the first embodimentwhere the memory semiconductor layer 441 is formed in a U shape.However, each of the modes described with reference to FIGS. 46 to 51may also be adopted for the example in the sixth embodiment.

[Others]

While certain embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the inventions. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the inventions. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the inventions.

What is claimed is:
 1. A nonvolatile semiconductor memory device,comprising: a plurality of conductive layers extending in a firstdirection, the plurality of conductive layers including a firstconductive layer, a second conductive layer, the first conductive layerand the second conductive layer being arranged in a second direction, athird conductive layer, the first conductive layer and the thirdconductive layer being arranged in a third direction through a firstinsulating plate, the first insulating plate extending in the firstdirection and the second direction, and a fourth conductive layer, thesecond conductive layer and the fourth conductive layer being arrangedin the third direction through the first insulating plate, the thirdconductive layer and the fourth conductive layer being arranged in thesecond direction; a first semiconductor layer extending in the seconddirection; a first charge accumulation portion surrounding the firstsemiconductor layer, the first conductive layer surrounding the firstcharge accumulation portion; a second semiconductor layer extending inthe second direction; and a second charge accumulation portionsurrounding the second semiconductor layer, the third conductive layersurrounding the second charge accumulation portion, wherein the firstconductive layer has a first surface facing the first insulating plate,the first surface having a first portion, a second portion and a thirdportion arranged in this order in the second direction, the thirdconductive layer has a second surface facing the first insulating plate,the second surface having a fourth portion, a fifth portion and a sixthportion arranged in this order in the second direction, a first distancebetween the first portion and the fourth portion in the third directionis larger than a second distance between the second portion and thefifth portion in the third direction, and a third distance between thethird portion and the sixth portion in the third direction is largerthan the second distance in the third direction.
 2. The nonvolatilesemiconductor memory device according to claim 1, wherein the firstportion is located at a position in the second direction correspondingto a surface of the first conductive layer opposite to the secondconductive layer, and the third portion is located at a position in thesecond direction corresponding to a surface of the first conductivelayer facing the second conductive layer.
 3. The nonvolatilesemiconductor memory device according to claim 1, wherein the fourthportion is located at a position in the second direction correspondingto a surface of the third conductive layer opposite to the fourthconductive layer, and the sixth portion is located at a position in thesecond direction corresponding to a surface of the third conductivelayer facing the fourth conductive layer.
 4. The nonvolatilesemiconductor memory device according to claim 1, wherein the secondconductive layer has a third surface facing the first insulating plate,the third surface having a seventh portion, an eighth portion and aninth portion arranged in this order in the second direction, the fourthconductive layer has a fourth surface facing the first insulating plate,the fourth surface having a tenth portion, an eleventh portion and atwelfth portion arranged in this order in the second direction, a fourthdistance between the seventh portion and the tenth portion in the thirddirection is larger than a fifth distance between the eighth portion andthe eleventh portion in the third direction, and a sixth distancebetween the ninth portion and the twelfth portion in the third directionis larger than the fifth distance in the third direction.
 5. Thenonvolatile semiconductor memory device according to claim 4, whereinthe first distance is larger than the fourth distance.
 6. Thenonvolatile semiconductor memory device according to claim 4, whereinthe second distance is larger than the fifth distance.
 7. Thenonvolatile semiconductor memory device according to claim 4, whereinthe third distance is larger than the sixth distance.
 8. The nonvolatilesemiconductor memory device according to claim 1, wherein the firstinsulating plate includes silicon oxide.
 9. The nonvolatilesemiconductor memory device according to claim 1, wherein the firstinsulating plate includes silicon nitride.
 10. The nonvolatilesemiconductor memory device according to claim 1, wherein each of thefirst and second conductive layers has a rounded portion facing thefirst insulating plate and having a curvature, and a radius of curvatureof the rounded portion of the first conductive layer is larger than aradius of curvature of the rounded portion of the second conductivelayer.
 11. The nonvolatile semiconductor memory device according toclaim 1, wherein each of the first and second conductive layers has arounded portion facing the first insulating plate and having acurvature, and a radius of curvature of the rounded portion of the firstconductive layer is smaller than a radius of curvature of the roundedportion of the second conductive layer.
 12. The nonvolatilesemiconductor memory device according to claim 10, wherein the roundedportion of the first conductive layer has a width of 1 nm or more in thesecond direction.
 13. The nonvolatile semiconductor memory deviceaccording to claim 10, wherein the rounded portion of the firstconductive layer has a curvature.
 14. The nonvolatile semiconductormemory device according to claim 13, wherein a radius of the curvatureof the rounded portion of the first conductive layer is 20 nm or more.15. The nonvolatile semiconductor memory device according to claim 1,further comprising an oxide portion that contacts the first surface ofthe first conductive layer.
 16. The nonvolatile semiconductor memorydevice according to claim 1, wherein the first conductive layer furtherincludes a silicide portion, the silicide portion has the first surfaceof the first conductive layer.
 17. The nonvolatile semiconductor memorydevice according to claim 16, further comprising an oxide-silicideportion that contacts the first surface of the first conductive layer.18. A nonvolatile semiconductor memory device, comprising: a pluralityof conductive layers extending in a first direction, the plurality ofconductive layers including a first conductive layer, a secondconductive layer, the first conductive layer and the second conductivelayer being arranged in a second direction, a third conductive layer,the first conductive layer and the third conductive layer being arrangedin a third direction, and a fourth conductive layer, the secondconductive layer and the fourth conductive layer being arranged in thethird direction, the third conductive layer and the fourth conductivelayer being arranged in the second direction; a first semiconductorlayer extending in the second direction; a first charge accumulationportion surrounding the first semiconductor layer, the first conductivelayer surrounding the first charge accumulation portion; a secondsemiconductor layer extending in the second direction; a second chargeaccumulation portion surrounding the second semiconductor layer, thethird conductive layer surrounding the second charge accumulationportion, a first insulating plate extending in the first direction andthe second direction, the first insulating plate being provided betweenthe first conductive layer and the third conductive layer and beingprovided between the second conductive layer and the fourth conductivelayer, a conductive plate extending in the first direction and thesecond direction, the conductive plate being provided between the firstconductive layer and the first insulating plate, and a second insulatingplate extending in the first direction and the second direction, thesecond insulating plate being provided between the first conductivelayer and the conductive plate, wherein the first conductive layer has afirst surface facing the second insulating plate, the first surfacehaving a first portion, a second portion and a third portion arranged inthis order in the second direction, the third conductive layer has asecond surface facing the first insulating plate, the second surfacehaving a fourth portion, a fifth portion and a sixth portion arranged inthis order in the second direction, a first distance between the firstportion and the fourth portion in the third direction is larger than asecond distance between the second portion and the fifth portion in thethird direction, and a third distance between the third portion and thesixth portion in the third direction is larger than the second distancein the third direction.
 19. The nonvolatile semiconductor memory deviceaccording to claim 18, wherein the first portion is located at aposition in the second direction corresponding to a surface of the firstconductive layer opposite to the second conductive layer, and the thirdportion is located at a position in the second direction correspondingto a surface of the first conductive layer facing the second conductivelayer.
 20. The nonvolatile semiconductor memory device according toclaim 18, wherein the fourth portion is located at a position in thesecond direction corresponding to a surface of the third conductivelayer opposite to the fourth conductive layer, and the sixth portion islocated at a position in the second direction corresponding to a surfaceof the third conductive layer facing the fourth conductive layer. 21.The nonvolatile semiconductor memory device according to claim 18,wherein the second conductive layer has a third surface facing thesecond insulating plate, the third surface having a seventh portion, aneighth portion and a ninth portion arranged in this order in the seconddirection, the fourth conductive layer has a fourth surface facing thefirst insulating plate, the fourth surface having a tenth portion, aneleventh portion and a twelfth portion arranged in this order in thesecond direction, a fourth distance between the seventh portion and thetenth portion in the third direction is larger than a fifth distancebetween the eighth portion and the eleventh portion in the thirddirection, and a sixth distance between the ninth portion and thetwelfth portion in the third direction is larger than the fifth distancein the third direction.
 22. The nonvolatile semiconductor memory deviceaccording to claim 21, wherein the first distance is larger than thefourth distance.
 23. The nonvolatile semiconductor memory deviceaccording to claim 21, wherein the second distance is larger than thefifth distance.
 24. The nonvolatile semiconductor memory deviceaccording to claim 21, wherein the third distance is larger than thesixth distance.
 25. The nonvolatile semiconductor memory deviceaccording to claim 18, wherein the first insulating plate includessilicon oxide.
 26. The nonvolatile semiconductor memory device accordingto claim 18, wherein the first insulating plate includes siliconnitride.
 27. The nonvolatile semiconductor memory device according toclaim 18, wherein each of the first and second conductive layers has arounded portion facing the second insulating plate and having acurvature, and a radius of curvature of the rounded portion of the firstconductive layer is larger than a radius of curvature of the roundedportion of the second conductive layer.
 28. The nonvolatilesemiconductor memory device according to claim 18, wherein each of thefirst and second conductive layers has a rounded portion facing thesecond insulating plate and having a curvature, and a radius ofcurvature of the rounded portion of the first conductive layer issmaller than a radius of curvature of the rounded portion of the secondconductive layer.
 29. The nonvolatile semiconductor memory deviceaccording to claim 27, wherein the rounded portion of the firstconductive layer has a width of 1 nm or more in the second direction.30. The nonvolatile semiconductor memory device according to claim 27,wherein the rounded portion of the first conductive layer has acurvature.
 31. The nonvolatile semiconductor memory device according toclaim 30, wherein a radius of the curvature of the rounded portion ofthe first conductive layer is 20 nm or more.
 32. The nonvolatilesemiconductor memory device according to claim 18, further comprising anoxide portion that contacts the first surface of the first conductivelayer.
 33. The nonvolatile semiconductor memory device according toclaim 18, wherein the first conductive layer further includes a silicideportion, the silicide portion has the first surface of the firstconductive layer.
 34. The nonvolatile semiconductor memory deviceaccording to claim 33, further comprising an oxide-silicide portion thatcontacts the first surface of the first conductive layer.